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전체선택

Semiconductor Fan-Out Polymer Adhesion on Physical Vapor Deposited Copper Coupling Temperature & Humidity Effects

회의자료

issue: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :179-180 Apr, 2024
Author: Lin, Nien-Chun
Shih, Hsin-Chih
Tsai, Ching-I
Kao, Chin-Li
Wang, Chen-Chao
Hung, C.P.
DB Label: Database : IEEE Xplore Digital Library

원문보기

Board-Level Drop Impact Reliability Analysis of Dual-Side Molding System-in- Package (SiP) Modules

학술저널

issue: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 70(1):215-221 Jan, 2023
Author: Shih, M.
Wu, N.
Lai, W.
Chen, T.
Kao, C.
Hung, C.P.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE) 등재 - Web of Science (SCIE) 등재 - SCOPUS 조회 - Impact Factor (JCR)

Mechanical and Thermal Characterization Analysis of Chip-last Fan-out Chip on Substrate

회의자료

issue: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1711-1719 May, 2022
Author: Yin, Wei-Jie
Lai, Wei-Hong
Lu, Ying-Xu
Chen, Karen Y.U.
Huang, Hung-Hsien
Chen, Tang-Yuan
Kao, Chin-Li
Hung, C.P.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Thermal and Mechanical Characterization of 2.5-D and Fan-Out Chip on Substrate Chip-First and Chip-Last Packages

학술저널

issue: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(2):297-305 Feb, 2022
Author: Shih, M.
Lai, W.
Liao, T.
Chen, K.
Chen, D.
Hung, C.P.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE) 등재 - Web of Science (SCIE) 등재 - SCOPUS 조회 - Impact Factor (JCR)

Epoxy Molding Compound Filler Clogging Simulation During Integrated Circuit Encapsulation Process

학술저널

issue: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(1):174-184 Jan, 2022
Author: Chen, B.
Hwang, S.
Chang, Y.
Yang, Y.
Lee, H.
Huang, B.
Hu, I.
Chen, D.
Tarng, D.
Hung, C.P.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE) 등재 - Web of Science (SCIE) 등재 - SCOPUS 조회 - Impact Factor (JCR)

Design for Void Free Transfer Molding SiP

회의자료

issue: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2020 15th International. :40-44 Oct, 2020
Author: Huang, B.-Y.
Hu, I.
Chen, J.D.L.
Tarng, D.
Hung, C.P.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Development of Ultra-Thin Thermal Ground Plane with High Performance Electroplated Wick

회의자료

issue: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020 19th IEEE Intersociety Conference on. :97-103 Jul, 2020
Author: Hu, I.
Huang, H.-H.
Huang, P.-C.
Yu, J.-C.
Liao, C.-N.
Shih, M.-K.
Tamg, D.
Hung, C.P.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

FE Simulation Model for Warpage Evaluation of Glass Interposer Substrate Packages

학술저널

issue: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(4):690-696 Apr, 2021
Author: Shih, M.
Chen, K.
Lee, T.
Tarng, D.
Hung, C.P.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE) 등재 - Web of Science (SCIE) 등재 - SCOPUS 조회 - Impact Factor (JCR)

A Comparative Study of 2.5D and Fan-out Chip on Substrate : Chip First and Chip Last

회의자료

issue: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :354-360 Jun, 2020
Author: Lai, W.-H.
Yang, P.
Hu, I.
Liao, T.-W.
Yu Chen, K.
Tarng, D.
Hung, C.P.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Package on System Level Solder Joint Stress Analysis Under Shock Test

회의자료

issue: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1509-1516 Jun, 2020
Author: Shih, H.-C.
Liao, H.
Chen, R.
Liao, Y.
Tarng, D.
Hung, C.P.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

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