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1. Cantilevers: Friend or Foe?

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2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP), 2018 Symposium on. :1-5 May, 2018
Author
Hong, Jing
Li, Xiaodong
Zhou, Di
Liu, Shuyi
Liu, Xin
Wang, Dong F.
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IEEE Xplore Digital Library
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In Materials Today: Proceedings 2020 21 Part 2:1176-1194
Author
Talekar, Nitesh
Kotambkar, Mangesh
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ScienceDirect
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2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on. :1-5 Apr, 2014
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Raghavan, Sathyanarayanan
Schmadlak, Ilko
Leal, George
Sitaraman, Suresh K.
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IEEE Xplore Digital Library
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TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International. :999-1002 Jun, 2007
Author
Li, Xinxin
Zuo, Guomin
Li, Peng
Zhang, Zhixiang
Wang, Yuelin
Cheng, Zhenxing
Liu, Min
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IEEE Xplore Digital Library
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2009 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS Design, Test, Integration & Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09. Symposium on. :140-144 Apr, 2009
Author
Ming-Tzer Lin
Chi-Jia Tong
Ya-Chi Cheng
Kuan-Jung Chung
Jiong-Shiun Hsu
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IEEE Xplore Digital Library
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2008 International Conference on Electronic Materials and Packaging Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on. :179-182 Oct, 2008
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Yan-Ting Chen
Ya-Chi Cheng
Kuan-Jung Chung
Ming-Tzer Lin
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IEEE Xplore Digital Library
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